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W25Q16BVDAIG Datasheet (PDF) - Winbond

W25Q16BVDAIG Datasheet PDF - Winbond
Part # W25Q16BVDAIG
Download  W25Q16BVDAIG Download

File Size   2067.87 Kbytes
Page   68 Pages
Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond
Description 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q16BVDAIG Datasheet (PDF)

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W25Q16BVDAIG Datasheet PDF - Winbond

Part # W25Q16BVDAIG
Download  W25Q16BVDAIG Click to download

File Size   2067.87 Kbytes
Page   68 Pages
Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond
Description 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q16BVDAIG Datasheet (HTML) - Winbond

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W25Q16BVDAIG Product details

GENERAL DESCRIPTION
The W25Q16BV (16M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in spacesaving packages.

FEATURES
• Family of SpiFlash Memories
    – W25Q16BV: 16M-bit / 2M-byte (2,097,152)
    – 256-bytes per programmable page
• Standard, Dual or Quad SPI
    – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
    – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
    – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
• Highest Performance Serial Flash
    – Up to 8X that of ordinary Serial Flash
    – 104MHz clock operation
    – 208MHz equivalent Dual SPI
    – 416MHz equivalent Quad SPI
    – 50MB/S continuous data transfer rate
• Efficient “Continuous Read Mode”
    – Low Instruction overhead
    – As few as 8 clocks to address memory
    – Allows true XIP (execute in place) operation
    – Outperforms X16 Parallel Flash
• Low Power, Wide Temperature Range
    – Single 2.7 to 3.6V supply
    – 4mA active current, <1µA Power-down (typ.)
    – -40°C to +85°C operating range
• Flexible Architecture with 4KB sectors
    – Uniform Sector Erase (4K-bytes)
    – Block Erase (32K and 64K-bytes)
    – Program one to 256 bytes
    – More than 100,000 erase/write cycles
    – More than 20-year data retention
• Advanced Security Features
    – Software and Hardware Write-Protect
    – Top or Bottom, Sector or Block selection
    – Lock-Down and OTP protection(1)
    – 64-Bit Unique ID for each device
• Space Efficient Packaging
    – 8-pin SOIC 150(2)/208-mil
    – 8-pad WSON 6x5-mm
    – 8-pin PDIP 300-mil(2)
    – 16-pin SOIC 300-mil(2)
    – Contact Winbond for KGD and other options




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