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W25Q16CV Datasheet (PDF) - Winbond

W25Q16CV Datasheet PDF - Winbond
Part # W25Q16CV
Download  W25Q16CV Download

File Size   1144.48 Kbytes
Page   79 Pages
Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond
Description 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q16CV Datasheet (PDF)

Go To PDF Page Download Datasheet
W25Q16CV Datasheet PDF - Winbond

Part # W25Q16CV
Download  W25Q16CV Click to download

File Size   1144.48 Kbytes
Page   79 Pages
Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond
Description 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q16CV Datasheet (HTML) - Winbond

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W25Q16CV Product details

GENERAL DESCRIPTION

The W25Q16CV (16M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. 



 FEATURES
• Family of SpiFlash Memories
    – W25Q16CV: 16M-bit / 2M-byte (2,097,152)
    – 256-byte per programmable page
    – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
    – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
    – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
• Highest Performance Serial Flash
    – 104MHz Dual SPI / Quad SPI clocks
    – 208/416MHz equivalent Dual/Quad SPI
    – 52MB/S continuous data transfer rate
    – Up to 8X that of ordinary Serial Flash
    – More than 100,000 erase/program cycles(1)
    – More than 20-year data retention
• Efficient “Continuous Read Mode”
    – Low Instruction overhead
    – Continuous Read with 8/16/32/64-Byte Wrap
    – As few as 8 clocks to address memory
    – Allows true XIP (execute in place) operation
    – Outperforms X16 Parallel Flash
• Low Power, Wide Temperature Range
    – Single 2.7 to 3.6V supply
    – 4mA active current, <1µA Power-down (typ.)
    – -40°C to +85°C operating range
• Flexible Architecture with 4KB sectors
    – Uniform Sector/Block Erase (4/32/64K-bytes)
    – Program one to 256 bytes
    – Erase/Program Suspend & Resume
• Advanced Security & Identification Features
    – Software and Hardware Write-Protect
    – Top/Bottom, 4KB complement array protection
    – Power Supply Lock-Down and OTP protection
    – 64-Bit Unique ID for each device
    – Discoverable Parameters (SFDP) Register
    – 3X256-Byte Security Registers with OTP locks
    – Volatile & Non-volatile Status Register Bits
• Space Efficient Packaging
    – 8-pin SOIC 150(2)/208-mil
    – 8-pad WSON 6x5-mm
    – 8-pin PDIP 300-mil(2)
    – 16-pin SOIC 300-mil(2)
    – 24-ball TFBGA 8x6-mm
    – Contact Winbond for KGD and other options




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