Manufacturer | Part # | Datasheet | Description |
 Molex Electronics Ltd. |
15-80-0381
|
40Kb / 2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
|
0015477538
|
388Kb / 4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 38 Circuits, Tin (Sn) Plating
|
0015800721
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, Tin (Sn) Plating
|
0015800087
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
|
0015800207
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
|
0015800681
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, Tin (Sn) Plating
|
0015800521
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, Tin (Sn) Plating
|
0015800281
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
|
0015800121
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
|
0015800421
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, Tin (Sn) Plating
|