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55091-0274 Datasheet (PDF) - MolexKits

55091-0274 Datasheet PDF - MolexKits
Part # 55091-0274
Download  55091-0274 Download

File Size   47.15 Kbytes
Page   6 Pages
Manufacturer  MOLEXKITS [MolexKits]
Direct Link  http://www.molexkits.com
Logo MOLEXKITS - MolexKits
Description Includes KK100,HDM,EBBl 50D, SEARAY,Plateau HS Mezz,IEEE1386,SlimStack Product Families. Pitches range:0.635mm-2.54mm

55091-0274 Datasheet (PDF)

Go To PDF Page Download Datasheet
55091-0274 Datasheet PDF - MolexKits

Part # 55091-0274
Download  55091-0274 Click to download

File Size   47.15 Kbytes
Page   6 Pages
Manufacturer  MOLEXKITS [MolexKits]
Direct Link  http://www.molexkits.com
Logo MOLEXKITS - MolexKits
Description Includes KK100,HDM,EBBl 50D, SEARAY,Plateau HS Mezz,IEEE1386,SlimStack Product Families. Pitches range:0.635mm-2.54mm

55091-0274 Datasheet (HTML) - MolexKits

55091-0274 Datasheet HTML 1Page - MolexKits 55091-0274 Datasheet HTML 2Page - MolexKits 55091-0274 Datasheet HTML 3Page - MolexKits 55091-0274 Datasheet HTML 4Page - MolexKits 55091-0274 Datasheet HTML 5Page - MolexKits 55091-0274 Datasheet HTML 6Page - MolexKits

55091-0274 Product details

Product Highlights
The SEARAY board-to-board connector is designed for computer, networking, telecom, storage and general market applications with high pin-count devices or memory modules that are mounted on mezzanine or module PC Boards (PCBs). The design of our SEARAY has superior electrical and mechanical features that are cost competitive. The unique, Molex-patented, solder charge technology results in better process yields and a lower applied cost versus equivalent BGA connector products. Circuit sizes range from 160 through 500 positions, and mated stack heights cover 7mm (.276") to 13mm (.512").

Features and Benefits
• Unique patented solder attach is more cost effective and reliable than BGA
• SEARAY footprint is compatible with other 1.27mm(.050") by 1.27mm(.050") products
• Robust guidance and polarization aligns connectors to mate in correct position
• Advanced gold-plated housings with integrated shielding system
• Two points of contact on each signal
• Multiple stack heights from 10 to25mm (.394 to .984")
• Available in 6, 12, 24, and 36 differential pair sizes (12, 24, 48 and 72 contacts)
• Up to 32mm board-to-board stack heights
• For parallel board packaging
• Available in press-fit or solder tail
• For Mezzanine cards, parallel backplanes and bridge board applications
• End walls facilitate blind mating
• Surface Mount Compatible
• High-density 2.00mm metric connector in the same form factor as Future bus
• 6-row 2mm connector provides 30 contacts per linear centimeter (> 75/inch)
• Designed for high-density, high-speed applications
• Modular components for design flexibility; 72 position (6 row by 12) and 144 position (6 row by 24) modules
• Tail lengths available in 0.5mm increments to optimize PCB thickness
• 3 GHz performance
• Cross Talk < 7%
• 6.00 to 16.00mm stack heights
• Economical design
• For 50 and 100 Ohm applications
• Anti-flux design
• Metal solder tabs provide PCB hold down and strain relief for SMT tails
• Polarizing pegs assist placement
• Housing lock on 20 to 60 circuits
• Superior terminal design/wipe length
• Easy board processing
• End-to-end stackable
• Strain relieving board hooks
• Also available without board hooks
• Various pin lengths available
• Voided circuits available (contact Molex)
• Versions to accept mating pins vertically, horizontally or through the PCB
• Leaf-style design protects pins
• Low insertion force
• For use in combinations of 1 to 4 mated pairs
• High-temperature LCP housing for use with lead-free processing temps
• Multiple stack heights 8.00-15.00mm (.315-.591"), offers design flexibility
• Low mating forces, less stress on PCB and solder joints
• Select 30u" Gold plating on contact, high reliability with 100-cycle durability rating
• Anti-flux intrusion feature, compatible with no-wash soldering processes
• Polarized D-shape leaf contact for parallel board packaging
• Leaf-style interface provides highdurability
• Available in 50, 68, and 80 circuits
• Blind-mate version
• SMT versions available
• Receptacle mates to standard .062 inch pc card edge
• Polarized guide posts allow extra lead-in on blind-mate versions
• Polarized guide features provide generous 2.0mm radial lead-in for blind mating
• Press-fit retention pegs for mechanical hold down before and after processing
• Low profile—12.50mm (.492") stack height for parallel board stacking
• Surface Mount Compatible

Applications
• High and Mid-Range Computers and Servers
• Medical Scanning Equipment
• Military
• Network Routers and Switches
• Mobile Base Stations
• Mobile Phone
• PDA
• Digital Video Camera
• Digital Still Camera
• Digital Video Player
• Digital Audio Player
• Voice Recorder
• Notebook PC
• Any Compact Applications
• Switches and Hubs
• Routers
• Servers and Blade Servers
• Workstations
• Storage Devices
• High-End Computer
• Storage
• Telecom (General)
• Broadcast Equipment
• Telecom Infrastructure
• Networking
• Telecom (Home/Office)
• Vending and Gaming Machines
• Production Equipment
• Industrial Instruments
• Energy and Power
• Comfort and Infotainment
• Brown Goods
• Security and Alarms
• Business Machines
• Computer Peripherals
• Consumer (General)
• Vending and Gaming
• Business Machines
• High-End Computer
• Production Equipment
• Network Interface Cards for NIC-HBA
• SCSI Host Bus and Adapter Cards for NIC-HBA
• Board-to-Board Mezzanine Connectors for SwitchRouter
• Mezzanine Card Connectors for Server
• Mezzanine Card Connectors for Disk Array




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