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HY27UF084G2B Datasheet (PDF) - Hynix Semiconductor

HY27UF084G2B Datasheet PDF - Hynix Semiconductor
Part # HY27UF084G2B
Download  HY27UF084G2B Download

File Size   386.06 Kbytes
Page   51 Pages
Manufacturer  HYNIX [Hynix Semiconductor]
Direct Link  http://www.skhynix.com/kor/main.do
Logo HYNIX - Hynix Semiconductor
Description 4Gbit (512Mx8bit) NAND Flash

HY27UF084G2B Datasheet (PDF)

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HY27UF084G2B Datasheet PDF - Hynix Semiconductor

Part # HY27UF084G2B
Download  HY27UF084G2B Click to download

File Size   386.06 Kbytes
Page   51 Pages
Manufacturer  HYNIX [Hynix Semiconductor]
Direct Link  http://www.skhynix.com/kor/main.do
Logo HYNIX - Hynix Semiconductor
Description 4Gbit (512Mx8bit) NAND Flash

HY27UF084G2B Datasheet (HTML) - Hynix Semiconductor

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HY27UF084G2B Product details

1.SUMMARY DESCRIPTION

Hynix NAND HY27UF(08/16)4G2B Series have 512Mx8bit with spare 16Mx8 bit capacity. The device is offered in 3.3 Vcc Power Supply, and with x8 and x16 I/O interface Its NAND cell provides the mostcost-effective solution for the solid state mass storage market. The memory is divided into blocks that can be erased independently so it is possible to preserve valid data while old data is erased.

The device contains 4096 blocks, composed by 64 pages. A program operation allows to write the 2112-byte page in typical 200us and an erase operation can be performed in typical 1.5ms on a 128K-byte block.

Data in the page can be read out at 25ns cycle time per byte(x8). The I/O pins serve as the ports for address and data input/output as wellas command input.



FEATURES SUMMARY

HIGH DENSITY NAND FLASH MEMORIES

- Cost effective solutions for mass storage applications

MULTIPLANE ARCHITECTURE

- Array is split into two independent planes. Parallel Operations on both planes are available, halving Program and erase time.

NAND INTERFACE

- x8/x16 bus width.

- Address/ Data Multiplexing

- Pinout compatiblity for all densities

SUPPLY VOLTAGE

- 3.3V device : Vcc = 2.7 V ~3.6 V

MEMORY CELL ARRAY

- x8 : (2K + 64) bytes x 64 pages x 4096 blocks

- x16 : (1K + 32) words x 64 pages x 4096 blocks

PAGE SIZE

- (2K + 64 spare) Bytes

- (1K + 32 spare) Words

BLOCK SIZE

- (128K + 4Kspare) Bytes

- (64K + 2Kspare) Words

PAGE READ / PROGRAM

- Random access : 25us (max.)

- Sequential access : 25ns (min.)

- Page program time : 200us (typ.)

- Multi-page program time (2 pages) : 200us (Typ)

COPY BACK PROGRAM

- Automatic block download without latency time

FAST BLOCK ERASE

- Block erase time: 1.5ms (Typ)

- Multi-block erase time (2 blocks) : 1.5ms (Typ) STATUS REGISTER

- Normal Status Register (Read/Program/Erase)

- Extended Status Register (EDC)

ELECTRONIC SIGNATURE

- 1st cycle : Manufacturer Code

- 2nd cycle : Device Code

- 3rd cycle : Internal chip number, Cell Type, Number of Simultaneously Programmed Pages.

- 4th cycle : Page size, Block size, Organization, Spare size

- 5th cycle : Multiplane information

CHIP ENABLE DON’T CARE

- Simple interface with microcontroller HARDWARE DATA PROTECTION

- Program/Erase locked during Power transitions. DATA RETENTION

- 100,000 Program/Erase cycles (with 1bit/528byte ECC)

- 10 years Data Retention

PACKAGE

- HY27UF(08/16)4G2B-T(P)

: 48-Pin TSOP1 (12 x 20 x 1.2 mm)

- HY27UF(08/16)4G2B-T (Lead)

- HY27UF(08/16)4G2B-TP (Lead Free)




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About Hynix Semiconductor


Hynix Semiconductor is a South Korean company that specializes in the design and manufacture of memory semiconductors.
The company was founded in 1983 and is headquartered in Icheon, South Korea.
Hynix is one of the world's leading producers of DRAM (dynamic random access memory) and NAND flash memory, which are used in various applications such as computer systems, mobile devices, and solid-state drives.
Hynix is known for its expertise in memory semiconductor technology and its ability to deliver high-quality and high-performance memory products to its customers.
The company has operations and facilities in various countries across the world and works closely with its customers to provide customized memory solutions that meet their specific requirements and needs.
In addition to its memory products, Hynix also provides a range of products and solutions for the automotive and data center markets, such as system-on-a-chip (SoC) products and high-bandwidth memory (HBM) products.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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