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TSON8-FL-V01 Datasheet (PDF) - Amkor Technology
TSON8-FL-V01 Datasheet PDF - Amkor Technology
Part # TSON8-FL-V01
Download  TSON8-FL-V01 Download
File Size   928.66 Kbytes
Page   2 Pages
Manufacturer  AMKOR [Amkor Technology]
Direct Link  http://www.amkor.com
Logo AMKOR - Amkor Technology
Description TSON8-FL (Flat Lead) is a smaller package (3.3 x 3.3 mm) with thermal enhancments that give a 64% reduction in footprint area compared with standard SOIC 8 ld package

TSON8-FL-V01 Datasheet (PDF)

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TSON8-FL-V01 Datasheet PDF - Amkor Technology

Part # TSON8-FL-V01
Download  TSON8-FL-V01 Click to download

File Size   928.66 Kbytes
Page   2 Pages
Manufacturer  AMKOR [Amkor Technology]
Direct Link  http://www.amkor.com
Logo AMKOR - Amkor Technology
Description TSON8-FL (Flat Lead) is a smaller package (3.3 x 3.3 mm) with thermal enhancments that give a 64% reduction in footprint area compared with standard SOIC 8 ld package

TSON8-FL-V01 Datasheet (HTML) - Amkor Technology


TSON8-FL-V01 Product details

FEATURES
Small and thermally enhanced package with the same power dissipation but 64% less footprint area than SOIC 8 ld
Dual Cu Clip interconnect for better heat dissipation efficiency
Clip + wire and multiple wire options are also available
Turnkey with test and packing services
Green materials: Pb-free plating & halogen-free mold compound

Applications
TSON8-FL is suitable for medium-power applications, designed for low on-resistance and high-speed-switching MOSFETs.
Battery protection circuits
Notebook PCs
Portable electronic devices
DC-DC converters




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About Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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