Application:
Electronic Components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive,
Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy
Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power
Electronics, Robot, Servers, Smart Home, Telecom, etc.

Features
•Best for filling the gap
•High compressibility
•Low hardness
•Lower pressure to heated components or PCB