Manufacturer | Part # | Datasheet | Description |
National Semiconductor ... |
MTC16
|
70Kb / 1P |
16 Lead Molded Thin Shrink Small Outline Package, JEDEC NS Package Number MTC16
|
MC28B
|
61Kb / 1P |
28 Lead Ceramic Small Outline Package, EPROM NS Package
|
W14B
|
62Kb / 1P |
14 Lead Ceramic Flatpack NS Package Number W14B
|
J24A
|
54Kb / 1P |
24 Lead Ceramic Dual-in-Line Package NS Package Number J24A
|
CERPACK
|
350Kb / 10P |
10 Lead Cerpack NS Package Number W10A
|
D24C
|
54Kb / 1P |
24 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D24C
|
D40C
|
59Kb / 1P |
40 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D40C
|
D16D
|
66Kb / 1P |
16 Lead Hybrid Metal Can Dual-in-Line Package NS Package Number D16D
|
STMicroelectronics |
SO-8
|
56Kb / 5P |
8-LEAD SMALL OUTLINE PACKAGE
|
National Semiconductor ... |
TA03A
|
59Kb / 1P |
3 Lead Molded TO-220 NS Package Number
|