Based on Qualcomm’s QCA9377, the CMP9377 is a multi-protocol connectivity module delivering the optimal combination of high performance and low power connectivity. The highly integrated module provides dual-band, single stream 802.11 ac plus Bluetooth v5.0. Support for high-speed Wi-Fi connectivity can deliver enriched media experiences for a variety of connected devices while optimized for energy efficiency to extend the usable battery life of portable devices. Offering advanced WLAN/Bluetooth coexistence algorithms, the CMP9377 supports superior rate-over-range throughput and low-latency performance in real-world RF operating conditions.
The integrated CPU manages the Wi-Fi stack to minimize resource requirements on your host platform. The low-level Bluetooth stack runs onboard with a Host Control Interface (HCI) to your host platform running the user-selected Bluetooth stack and profile combination. Support for all Bluetooth profiles and BLE services is integrated.

KEY FEATURES
• 802.11 a/b/g/n/ac Wave 2 MU-MIMO
o Dual-Band Wi-Fi support (2.4 GHz / 5 GHz)
o Integrated Coexistence Manager
o Dedicated CPU for WLAN stack
o 20/40/80 MHz channel support
o MU-MIMO, Transmit Beamforming (PCIe only)
o Pout of 18 dBm
• Bluetooth v5.0 Smart Ready
o Host Control Interface (HCI)
o Pout of 8 dBm (Bluetooth)
o Pout of 4 dBm (BLE)
• Wireless Coexistence
o Concurrent Wi-Fi and BLE
o Per-Packet Coexistence Manager
• Power Management Features
o Single 3.3V Regulated Supply
o Clock Gating to idle blocks
o Processor Frequency Scaling
• WLAN Interface Options (Versions not pin compatible)
o SDIO (CMP9377-Sx)
o USB v2.0 (CMP9377-Ux)
o PCIe (CMP9377-P)
• Bluetooth Interface Options
o UART (CMP9377-Sx)
o USB (CMP9377-Ux; CMP9377-P)
• Antenna Options
o Integrated dual-band chip
o RF Connector (I-PEX MHF4 P/N 20449-001E)
• Compact Form Factor
o 17 x 12 x 3 mm (CMP9377-SC/UC)
o 24 x 12 x 3 mm (CMP9377-SA/UA)
o 30 x 16.5 mm M.2 (CMP9377-P)
• Operating Temperature: -40° C to +85°C
• Certifications
o FCC
o IC
o CE RED

HOST DRIVER SUPPORT
• Source Code available for multiple HW/OS reference platforms:
o Android
o Linux
o Windows
• Platform Porting Options
o Porting Guides available
o Custom driver development available through Engineering Services contract