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AM2431BSDFHIALVR Datasheet (PDF) - Texas Instruments

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AM2431BSDFHIALVR Datasheet PDF - Texas Instruments
Part # AM2431BSDFHIALVR
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File Size   6667.8 Kbytes
Page   280 Pages
Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments
Description AM243x Sitara™ Microcontrollers

AM2431BSDFHIALVR Datasheet (PDF)

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AM2431BSDFHIALVR Datasheet PDF - Texas Instruments

Part # AM2431BSDFHIALVR
Download  AM2431BSDFHIALVR Click to download

File Size   6667.8 Kbytes
Page   280 Pages
Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments
Description AM243x Sitara™ Microcontrollers

AM2431BSDFHIALVR Datasheet (HTML) - Texas Instruments

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AM2431BSDFHIALVR Product details

1 Features
Processor cores:
• Up to 2× Dual-core Arm Cortex®-R5F MCU
subsystems operating at up to 800 MHz, highlyintegrated
for real-time processing
– Dual-core Arm Cortex®-R5F clusters support
dual-core and single-core operation
– 32KB ICache and 32KB DCache per R5F core
with SECDED ECC on all memories
– Single-core: 128KB TCM per cluster (128KB
TCM per R5F core)
– Dual-core: 128KB TCM per cluster (64KB TCM
per R5F core)
• 1× Single-core Arm Cortex®-M4F MCU at up to
400 MHz
– 256KB SRAM with SECDED ECC
Memory subsystem:
• Up to 2MB of On-chip RAM (OCSRAM) with
SECDED ECC:
– Can be divided into smaller banks in
increments of 256KB for as many as 8 separate
memory banks
– Each memory bank can be allocated to a single
core to facilitate software task partitioning
• DDR Subsystem (DDRSS)
– Supports LPDDR4, DDR4 memory types
– 16-Bit data bus with inline ECC
– Supports speeds up to 1600 MT/s
System on Chip (SoC) services:
• Device Management Security Controller (DMSC-L)
– Centralized SoC system controller
– Manages system services including initial boot,
security, and clock/reset/power management
– Communication with various processing units
over message manager
– Simplified interface for optimizing unused
peripherals
– On-Chip Debug functionality through JTAG and
Trace interfaces)
• Data Movement Subsystem (DMSS)
– Block Copy DMA (BCDMA)
– Packet DMA (PKTDMA)
– Secure Proxy (SEC_PROXY)
– Ring Accelerator (RINGACC)
• Time Sync Subsystem
– Central Platform Time Sync (CPTS) module
– Timer Manager (TIMERMANAGER) with 1024
timers
– Time Sync and Compare event interrupt routers
Industrial subsystem:
• 2× Gigabit Industrial Communication Subsystems
(PRU_ICSSG)
– Optional support for Profinet IRT, Profinet
RT, EtherNet/IP, EtherCAT, Time-Sensitive
Networking (TSN), and other Networking
Protocols
– Backwards compatibility with 10/100Mb
PRU_ICSS
– Each PRU_ICSSG contains:
• 3× PRU RISC Cores per Slice (2× Slice per
PRU_ICSSG)
– PRU General Use core (PRU)
– PRU Real-Time Unit core (PRU-RTU)
– PRU Transmit core (PRU-TX)
• Each PRU core supports the following
features:
– Instruction RAM with ECC
– Broadside RAM
– Multiplier with optional accumulator
(MAC)
– CRC16/32 hardware accelerator
– Byte swap for Big/Little Endian
conversion
– SUM32 hardware accelerator for UDP
checksum
– Task Manager for preemption support
• Up to 2× Ethernet ports
– RGMII (10/100/1000)
– MII (10/100)
• Three Data RAMs with ECC
• 8 banks of 30 × 32-bit register scratchpad
memory
• Interrupt controller and task manager
• 2× 64-bit Industrial Ethernet Peripherals
(IEPs) for time stamping and other time
synchronization functions
• 18× Sigma-Delta Filter Module (SDFM)
interfaces
– Short circuit logic
– Over-current logic
• 6× Multi-protocol position encoder interfaces
• 1× Enhanced Capture Module (ECAP)
• 16550-compatible UART
– Dedicated 192-MHz clock to support 12-
Mbps PROFIBUS
Security:
• Secure Boot supported
– Hardware-enforced Root-of-Trust (RoT)
– Support to switch RoT via backup key
– Support for takeover protection, IP protection,
and anti-roll back protection
• Support for cryptographic acceleration
– Session-aware cryptographic engine with ability
to auto-switch key-material based on incoming
data stream
– DMA support
– Supports cryptographic cores
• AES – 128/192/256-bit key sizes
• 3DES – 56/112/168-bit key sizes
• MD5, SHA1
• SHA2 – 224/256/384/512-bit key sizes
• DRBG with true random number generator
• PKA (Public Key Accelerator) to Assist in
RSA/ECC processing
• Debugging security
– Secure software-controlled debug access
– Security aware debugging
• Secure storage support
• On-the-Fly encryption (OTFE) support for OSPI in
XIP mode
• Networking security support for data (Payload)
encryption/authentication via packet-based
hardware cryptographic engine
• DMSC-L co-processor for security and key
management, with dedicated device level
interconnect
General connectivity peripherals:
• 6× Inter-Integrated Circuit (I2C) ports
• 9× configurable Universal Asynchronous Receive/
Transmit (UART) modules
• 1× 12-bit Analog-to-Digital Converters (ADC)
– Configurable sample rate up to 4 MSPS
– 8× multiplexed analog inputs
• 7× Multichannel Serial Peripheral Interfaces (SPI)
controllers
• 3× General-Purpose I/O (GPIO) modules
Industrial and control interfaces:
• 9× Enhanced Pulse-Width Modulator (EPWM)
modules
• 3× Enhanced Capture (ECAP) modules
• 3× Enhanced Quadrature Encoder Pulse (EQEP)
modules
• 2× Modular Controller Area Network (MCAN)
modules with full CAN-FD support
• 2× Fast Serial Interface Transmitter (FSITX) cores
• 6× Fast Serial Interface Receiver (FSIRX) cores
High-speed interfaces:
• 1× Integrated Ethernet switch supporting up to 2
external ports (CPSW3G)
– Up to 2 Ethernet ports
• RGMII (10/100/1000)
• RMII (10/100)
– IEEE 1588 (2008 Annex D, Annex E, Annex F)
with 802.1AS PTP
– Clause 45 MDIO PHY management
– Energy efficient Ethernet (802.3az)
• 1× PCI-Express® Gen2 controller (PCIE)
– Supports Gen2 Single Lane operation
• 1× USB 3.1 Dual-Role Device (DRD) Subsystem
(USBSS)
– Port configurable as USB host, USB device, or
USB Dual-Role device
– USB device: High-speed (480 Mbps) and Fullspeed
(12 Mbps)
– USB host: SuperSpeed Gen 1 (5 Gbps), Highspeed
(480 Mbps),Full-speed (12 Mbps), and
Low-speed (1.5 Mbps)
– Integrated USB VBUS detection
• 1× Serializer/Deserializer (SERDES)
– One SerDes PHY lane to support either PCIExpress
® Gen2 or USB Super-Speed Gen1
Media and data storage:
• 2× MultiMedia Card/Secure Digital (MMCSD)
interfaces
– One 8-bit for eMMC (MMCSD0)
– One 4-bit for SD/SDIO (MMCSD1)
– Integrated analog switch for voltage switching
between 3.3V to 1.8V for high-speed cards
• 1× General-Purpose Memory Controller (GPMC)
– 16-bit parallel bus with 133 MHz clock or
– 32-bit parallel bus with 100 MHz clock
– Error Location Module (ELM) support
• 1× Flash Subsystem (FSS) that can be configured
as one Octal SPI (OSPI) or one Quad SPI (QSPI)
flash interface
Power management:
• Simplified power sequencing requirements
• Dual-voltage I/O Support
• Integrated SDIO LDO for handling automatic
voltage transition for SD interface
• Integrated voltage supervisor for safety monitoring
of over-under voltage conditions
• Integrated power supply glitch detector for
detecting fast supply transients
Functional Safety:
• Functional Safety-compliant Targeted
– Developed for functional safety applications
– Documentation available to aid IEC 61508
functional safety system design
– Systematic capability up to SIL 3
– Hardware integrity up to SIL 2 targeted
– Safety-related certification
• IEC 61508 certification planned
– ECC or parity on calculation-critical memories
– ECC and parity on select internal bus
interconnects
– Built-In Self-Test (BIST) for CPU and on-chip
RAM
– Error Signaling Module (ESM) with external
error pin
– Run-time safety diagnostics, including:
• Voltage, Temperature, and Clock Monitoring
• Windowed Watchdog Timers
• CRC Engine for memory integrity checks
– MCU domain with dedicated memory,
interfaces, and M4F core capable of being
isolated from the larger SoC with Freedom
From Interference (FFI) features:
• Separate interconnect
• Firewalls and timeout gaskets
• Controlled reset isolation
• Dedicated MCU PLL and MMR control
• Separate I/O Voltage Supply Rail
SoC architecture:
• Supports primary boot from UART, I2C, OSPI/
QSPI Flash, SPI Flash, parallel NOR Flash,
parallel NAND Flash, SD, eMMC, USB 2.0, PCIe,
and Ethernet interfaces
• 16-nm FinFET technology
Package options:
• ALV: 17.2 mm × 17.2 mm, 0.8 mm pitch (441-pin)
FCBGA [Lidded] Flip-Chip Ball Grid Array ALV
package
• ALX: 11.0 mm × 11.0 mm, 0.5 mm pitch (293-pin)
FC/CSP [SiP] Flip-Chip/Chip Scale Package ALX
package

2 Applications
• Programmable Logic Controller (PLC)
• Motor Drives
• Remote I/O
• Industrial Robots
• Communication Module
• Field Transmitter
• Test & Measurement
• General Purpose Controller

3 Description
AM243x is an extension of Sitara’s industrial-grade portfolio into high-performance microcontrollers. The
AM243x device is built for industrial applications, such as motor drives and remote I/O modules, which require a
combination of real-time communications and processing. The AM243x family provides scalable performance
with up to four Cortex-R5F MCUs, one Cortex-M4F, and two instances of Sitara’s gigabit TSN-enabled
PRU_ICSSG.
The AM243x SoC architecture was designed to provide best-in-class real-time performance through the highperformance
Arm Cortex-R5F cores, Tightly-Coupled Memory banks, configurable SRAM partitioning, and
dedicated low-latency paths to and from peripherals for rapid data movement in and out of the SoC. This
deterministic architecture allows for AM243x to handle the tight control loops found in servo drives while
the peripherals like FSI, GPMC, ECAPs, PWMs, and encoder interfaces help enable a number of different
architectures found in these systems.
The SoC provides flexible industrial communications capability including full protocol stacks for EtherCAT target,
PROFINET device, EtherNet/IP adapter, and IO-Link Controller. The PRU_ICSSG further provides capability for
gigabit and TSN based protocols. In addition, the PRU_ICSSG enables additional interfaces including a UART
interface, sigma delta decimation filters, and absolute encoder interfaces.
Functional safety features can be enabled through the integrated Cortex-M4F along with dedicated peripherals
which can all be isolated from the rest of the SoC. AM243x also supports secure boot.




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About Texas Instruments


Texas Instruments (TI) is a publicly traded company that designs and manufactures semiconductor and computer technology products.

It was founded in 1930 and is headquartered in Dallas, Texas.

TI is a global leader in the production of analog and digital signal processing (DSP) integrated circuits, as well as embedded processors and other microcontroller products.

The company serves customers in a variety of industries, including automotive, communications, computing, industrial, and consumer electronics.

TI's product portfolio includes data converters, amplifiers and comparators, power management ICs, microcontrollers, sensors, and wireless connectivity solutions, among others.

TI is committed to innovation and customer satisfaction, and has a long history of delivering high-quality, reliable products to its customers.

With a focus on sustainability and energy efficiency, TI is dedicated to making a positive impact on the world through its technology and products.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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