Manufacturer | Part # | Datasheet | Description |
 NXP Semiconductors |
SOT340-1
|
11Kb / 1P |
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
2003 Mar 24 |
 List of Unclassifed Man... |
40-05-015
|
25Kb / 1P |
Package Outline: 48 lead 300 mil SSOP
|
 ACCUTEK MICROCIRCUIT CO... |
AK16D300
|
79Kb / 3P |
Shrink Small Outline Package SSOP DIP Adapters
|
 Panasonic Semiconductor |
LN217RPH
|
317Kb / 3P |
5.3 mm 횞 1.8 mm
|
 Maxim Integrated Produc... |
21-0146A
|
40Kb / 1P |
PACKAGE OUTLINE 52L TQFP, 10x10x1.0 MM
Rev A |
 Dallas Semiconductor |
21-0102
|
109Kb / 2P |
PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
|
 National Semiconductor ... |
MSC16
|
24Kb / 1P |
MOLDED PACKAGE SSOP, EIAJ
|
 Panasonic Semiconductor |
LN217RP
|
53Kb / 2P |
5.3 mm x 1.8 mm Series
|
LN217RPH
|
31Kb / 1P |
5.3 mm X 1.8 mm Series
|
 Fairchild Semiconductor |
MSA20
|
12Kb / 1P |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20
|