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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 1360 (8/68) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0878982026 Datasheet pdf image
1Mb/22P
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 20 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
0901200778 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 18 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0901200926 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 6 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0901200782 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 22 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0878320620 Datasheet pdf image
379Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 6 Circuits, 0.38關m (15關) Gold (Au) Plating
0901200763 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 3 Circuits, 0.38關m (15關") Gold (Au) Selective Plating
0878323220 Datasheet pdf image
379Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 32 Circuits, 0.38關m (15關) Gold (Au) Plating
0878322020 Datasheet pdf image
379Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 20 Circuits, 0.38關m (15關) Gold (Au) Plating
0878324622 Datasheet pdf image
379Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree, 46 Circuits, 0.38關m (15關) Gold (Au) Plating
0901200764 Datasheet pdf image
1Mb/3P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0878323421 Datasheet pdf image
398Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 34 Circuits, 0.76關m (30關) Gold (Au) Plating
0901200925 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 5 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0901209766 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0901200772 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0901200923 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 3 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0901209924 Datasheet pdf image
224Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0878322021 Datasheet pdf image
398Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 20 Circuits, 0.76關m (30關) Gold (Au) Plating
0878324821 Datasheet pdf image
398Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree, 48 Circuits, 0.76關m (30關) Gold (Au) Plating
0901200773 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 13 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0901200770 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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