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PLATING Datasheet, PDF

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Searched Keyword : 'PLATING' - Total: 136 (7/7) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd. 		15-91-3104 Datasheet pdf image
47Kb/2P		 2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 10 Circuits, Tin (Sn) Plating
15-91-3164 Datasheet pdf image
47Kb/2P		 2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 16 Circuits, Tin (Sn) Plating
15-91-3174 Datasheet pdf image
40Kb/2P		 2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 17 Circuits, Tin (Sn) Plating
15-91-3234 Datasheet pdf image
40Kb/2P		 2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 23 Circuits, Tin (Sn) Plating
0365150459 Datasheet pdf image
185Kb/4P		 2.54mm (.100") Pitch DIN 41612 R Style Male Header with Wire-Wrap, Vertical, Through Hole Press-Fit, 0.60關m (24關") Selective Gold (Au) Plating, 96 Circuits
0365150015 Datasheet pdf image
203Kb/4P		 2.54mm (.100") Pitch DIN 41612 R Style Male Header with Wire-Wrap, Vertical, Through Hole Press-Fit, 0.30關m (12關") Selective Gold (Au) Plating, 96 Circuits
0365150488 Datasheet pdf image
182Kb/4P		 2.54mm (.100") Pitch DIN 41612 R Style Male Header with Wire-Wrap, Vertical, Through Hole Press-Fit, 0.60關m (24關") Selective Gold (Au) Plating, 64 Circuits
0430451207 Datasheet pdf image
195Kb/3P		 3.00mm (.118") Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 12 Circuits, 0.38um (15u") Gold (Au) Selective Plating, Glow Wire Compatible
0436500317 Datasheet pdf image
165Kb/3P		 3.00mm (.118") Pitch Micro-Fit 3.0??Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 3 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Glow Wire Compatible
0430450216 Datasheet pdf image
185Kb/3P		 3.00mm (.118") Pitch Micro-Fit 3.0??Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 2 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Glow Wire Compatible
0430451626 Datasheet pdf image
194Kb/3P		 3.00mm (.118") Pitch Micro-Fit 3.0??Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 16 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Glow Wire Compatible
0430451825 Datasheet pdf image
194Kb/3P		 3.00mm (.118") Pitch Micro-Fit 3.0??Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Glow Wire Compatible
0436500405 Datasheet pdf image
163Kb/3P		 3.00mm (.118") Pitch Micro-Fit 3.0??Header, Surface Mount Compatible, Single Row, Right Angle, with Press-fit Metal Retention Clip, 4 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Glow Wire Compatible
0430451202 Datasheet pdf image
201Kb/3P		 3.00mm (.118") Pitch Micro-Fit 3.0??Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 12 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Glow Wire Compatible
0365000099 Datasheet pdf image
216Kb/4P		 2.54mm (.100") Pitch DIN 41612 C Style Female Receptacle, Vertical, Through Hole, 0.30關m (12關") Selective Gold (Au) Plating, 64 Circuits, without Mounting Clips, Solder Tail Length 2.90mm (.114"), No Flux Proof, Lead Free
0365150487 Datasheet pdf image
183Kb/4P		 2.54mm(.100") Pitch DIN 41612 R Style Male Header with Wire-Wrap, Vertical, Through Hole Press-Fit, 0.60關m(24關") Selective Gold (Au) Plating, 96 Circuits, without Mounting Clips, First-Mate-Last-Break at a14;a28, Soldertail Length 13.25mm(.522"), Lead F

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What is PLATING

Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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