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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 860 (6/43) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0702474052 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded40 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702476052 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded60 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702474851 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded48 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702471652 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702475052 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded50 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702474051 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded40 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702475652 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded56 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702466402 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 64 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702462001 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702473051 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702471251 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded12 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702472052 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded20 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702473052 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702472651 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702472451 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded24 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702476452 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded64 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702464002 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 40 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702462002 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702474451 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded44 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702476051 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded,60 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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