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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 860 (5/43) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0702460802 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630120 Datasheet pdf image
225Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702466002 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 60Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430107 Datasheet pdf image
429Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 3 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702463001 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702466001 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 60Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630015 Datasheet pdf image
225Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430010 Datasheet pdf image
429Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 11 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702461402 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702471054 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC Tail Plating
0702461202 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 12Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702461201 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 12Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702461004 Datasheet pdf image
188Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.13關m (5關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430122 Datasheet pdf image
429Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 18 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702471452 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded14 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702472652 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702471051 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702471451 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded14 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702473451 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded34 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702462602 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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