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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 136 (4/7) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
15-91-3160 Datasheet pdf image
35Kb/2P
2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 16 Circuits, 0.76關m Gold (Au) Selective Plating, without PCB Locator Pegs
15-91-3220 Datasheet pdf image
35Kb/2P
2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 22 Circuits, 0.76關m Gold (Au) Selective Plating, without PCB Locator Pegs
15-91-3080 Datasheet pdf image
35Kb/2P
2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 0.76關m Gold (Au) Selective Plating, without PCB Locator Pegs
0365050027 Datasheet pdf image
261Kb/4P
2.54mm (.100") Pitch DIN 41612 B Style Female Receptacle, Vertical, Through Hole, 0.30關m (12關") Selective Gold (Au) Plating, 64 Circuits
0416710007 Datasheet pdf image
276Kb/10P
3.96mm (.156") Pitch KK짰 Header, Breakaway, Vertical, Square Pin, with Friction Lock, 8 Circuits, 0.38關m (15關") Gold (Au) Selective Plating
15-91-3140 Datasheet pdf image
35Kb/2P
2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.76關m Gold (Au) Selective Plating, without PCB Locator Pegs
0365090027 Datasheet pdf image
201Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Female Receptacle, Right Angle, Through Hole, 0.30關m (12關") Selective Gold (Au) Plating, 64 Circuits
0365090044 Datasheet pdf image
193Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Female Receptacle, Right Angle, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 64 Circuits
0365020134 Datasheet pdf image
170Kb/4P
2.54mm (.100") Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 0.30關m (12關") Selective Gold (Au) Plating, 96 Circuits
0365090003 Datasheet pdf image
199Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Female Receptacle, Right Angle, Through Hole, 0.30關m (12關") Selective Gold (Au) Plating, 96 Circuits
0365090038 Datasheet pdf image
193Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Female Receptacle, Right Angle, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 64 Circuits
0365090001 Datasheet pdf image
202Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Female Receptacle, Right Angle, Through Hole, 1.10關m (43關") Selective Gold (Au) Plating, 96 Circuits
0365090020 Datasheet pdf image
192Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Female Receptacle, Right Angle, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 96 Circuits
0365020143 Datasheet pdf image
212Kb/4P
2.54mm (.100") Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 0.30關m (12關") Selective Gold (Au) Plating, 32 Circuits
0365090032 Datasheet pdf image
200Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Female Receptacle, Right Angle, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 64 Circuits
0365010121 Datasheet pdf image
201Kb/4P
2.54mm (.100") Pitch DIN 41612 C/2 Style Female Receptacle, Vertical, Through Hole, 1.10關m (43關") Selective Gold (Au) Plating, 32 Circuits
0365010293 Datasheet pdf image
156Kb/4P
2.54mm (.100") Pitch DIN 41612 C/2 Style Female Receptacle, Vertical, Through Hole, 0.40關m (16關") Selective Gold (Au) Plating, 48 Circuits
0365090008 Datasheet pdf image
202Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Female Receptacle, Right Angle, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 96 Circuits
0365090074 Datasheet pdf image
204Kb/4P
2.54mm (.100") Pitch DIN 41612 R Style Female Receptacle, Right Angle, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 64 Circuits
0365010026 Datasheet pdf image
200Kb/4P
2.54mm (.100") Pitch DIN 41612 C/2 Style Female Receptacle, Vertical, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 48 Circuits

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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