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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 1360 (3/68) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0901210138 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 18 Circuits, Tin (Sn) Plating
0901210127 Datasheet pdf image
211Kb/3P
2.54mm (.100") Pitch C-Grid III??Header, Single Row, Right Angle, 7 Circuits, Tin (Sn) Plating
0901210157 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 37 Circuits, Tin (Sn) Plating
0901210149 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 29 Circuits, Tin (Sn) Plating
0901210158 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 38 Circuits, Tin (Sn) Plating
0901210150 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 30 Circuits, Tin (Sn) Plating
0901210152 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 32 Circuits, Tin (Sn) Plating
0901210132 Datasheet pdf image
211Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 12 Circuits, Tin (Sn) Plating
0901210154 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 34 Circuits, Tin (Sn) Plating
0901210121 Datasheet pdf image
211Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 1 Circuit, Tin (Sn) Plating
0901210142 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 22 Circuits, Tin (Sn) Plating
0901210143 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 23 Circuits, Tin (Sn) Plating
0901471217 Datasheet pdf image
181Kb/4P
2.54mm (.100) Pitch C-Grid짰 PC Board Connector, Single Row, Vertical, 17 Circuits, Tin (Sn) Plating
0901210153 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 33 Circuits, Tin (Sn) Plating
0901210125 Datasheet pdf image
211Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 5 Circuits, Tin (Sn) Plating
0901210140 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 20 Circuits, Tin (Sn) Plating
0901210159 Datasheet pdf image
210Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 39 Circuits, Tin (Sn) Plating
0901210126 Datasheet pdf image
211Kb/4P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 6 Circuits, Tin (Sn) Plating
0901210160 Datasheet pdf image
150Kb/3P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 40 Circuits, Tin (Sn) Plating
0901210292 Datasheet pdf image
134Kb/3P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle 12 Circuits, Gold (Au) Plating

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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