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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 860 (2/43) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0705430014 Datasheet pdf image
429Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 15Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430126 Datasheet pdf image
429Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 22Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430123 Datasheet pdf image
429Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 19Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630021 Datasheet pdf image
225Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 22Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630013 Datasheet pdf image
225Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 14Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430020 Datasheet pdf image
429Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 21Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702464004 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 40Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC Tail Plating
0705430117 Datasheet pdf image
429Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 13Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702461604 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC Tail Plating
0705630110 Datasheet pdf image
225Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 6Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702462004 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC Tail Plating
0705630116 Datasheet pdf image
225Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 12Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430004 Datasheet pdf image
429Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 5Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430108 Datasheet pdf image
429Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 4Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630114 Datasheet pdf image
225Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 10Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430111 Datasheet pdf image
429Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 7Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630129 Datasheet pdf image
225Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 25Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630108 Datasheet pdf image
225Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 4Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430002 Datasheet pdf image
429Kb/4P
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 3Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702463404 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC Tail Plating

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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