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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 1360 (11/68) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0878981626 Datasheet pdf image
1Mb/22P
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 16 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
0878322821 Datasheet pdf image
398Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 28 Circuits, 0.76關m (30關) Gold (Au) Plating
0878980626 Datasheet pdf image
1Mb/22P
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 6 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
0901200780 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0901200922 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 2 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0901200771 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 11 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0901200956 Datasheet pdf image
144Kb/3P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 36 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0878324220 Datasheet pdf image
379Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 42 Circuits, 0.38關m (15關) Gold (Au) Plating
0878324021 Datasheet pdf image
398Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree, 40 Circuits, 0.76關m (30關) Gold (Au) Plating
0901200950 Datasheet pdf image
144Kb/3P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 30 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0878980526 Datasheet pdf image
1Mb/22P
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 5 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
0901200769 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 9 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0878321621 Datasheet pdf image
398Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 16 Circuits, 0.76關m (30關) Gold (Au) Plating
0901200762 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 2 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0901200790 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 30 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0878323221 Datasheet pdf image
398Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 32 Circuits, 0.76關m (30關) Gold (Au) Plating
0901200936 Datasheet pdf image
144Kb/3P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0878320421 Datasheet pdf image
464Kb/7P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree,4 Circuits, 0.76關m (30關) Gold (Au) Plating
0878322220 Datasheet pdf image
379Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 22 Circuits, 0.38關m (15關) Gold (Au) Plating
0150180083 Datasheet pdf image
39Kb/1P
0.50mm Pitch Premo-Flex FFC Jumper with Ears, Same Side Contacts (Type A), 152.00mm Cable Length, Gold (Au) Plating, 8 Circuits

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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