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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 1360 (10/68) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0878323820 Datasheet pdf image
379Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 38 Circuits, 0.38關m (15關) Gold (Au) Plating
0901200767 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 7 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0878322820 Datasheet pdf image
379Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree, 28 Circuits, 0.38關m (15關) Gold (Au) Plating
0878322621 Datasheet pdf image
398Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree, 26 Circuits, 0.76關m (30關) Gold (Au) Plating
0878324620 Datasheet pdf image
379Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 46 Circuits, 0.38關m (15關) Gold (Au) Plating
0901200927 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 7 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0901200775 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 15 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0901200934 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 14 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0878324820 Datasheet pdf image
379Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree, 48 Circuits, 0.38關m (15關) Gold (Au) Plating
0878980306 Datasheet pdf image
1Mb/22P
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 3 Circuits, Tin (Sn) Overall Plating, Tray Packaging, without Cap, Lead- free
0878321820 Datasheet pdf image
379Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 18 Circuits, 0.38關m (15關) Gold (Au) Plating
0901200765 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 5 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0878321620 Datasheet pdf image
379Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 16 Circuits, 0.38關m (15關) Gold (Au) Plating
0878982426 Datasheet pdf image
1Mb/22P
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 24 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
0878325021 Datasheet pdf image
398Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree, 50 Circuits, 0.76關m (30關) Gold (Au) Plating
0901200928 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 8 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0150180215 Datasheet pdf image
39Kb/1P
0.50mm Pitch Premo-Flex FFC Jumper with Ears, Same Side Contacts (Type A), 152.00mm Cable Length, Gold (Au) Plating, 20 Circuits
0901200776 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 16 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0901200935 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 15 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0878323821 Datasheet pdf image
398Kb/6P
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 38 Circuits, 0.76關m (30關) Gold (Au) Plating,

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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