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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 1360 (1/68) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
180412-0001 Datasheet pdf image
49Kb/1P
LED Array Holder for Citizen CLL010, Gold (Au) Plating
0900590014 Datasheet pdf image
167Kb/3P
2.54mm (.100) Pitch C-Grid짰 Micro Shunt, Low Profile, 4mm Gold Plating
0900590013 Datasheet pdf image
163Kb/2P
2.54mm (.100) Pitch C-Grid짰 Micro Shunt, Low Profile, 35mm Pretinned Plating
180414-0102 Datasheet pdf image
51Kb/1P
LED Array Holder for Citizen CLL020, Gold (Au) Plating - One Piece Design
0900591007 Datasheet pdf image
163Kb/2P
2.54mm (.100) Pitch C-Grid짰 Micro Shunt, Low Profile, 200mm Tin (Sn) Plating
0900590007 Datasheet pdf image
163Kb/2P
2.54mm (.100) Pitch C-Grid짰 Micro Shunt, Low Profile, 200mm Tin (Sn) Plating
180414-0001 Datasheet pdf image
46Kb/1P
LED Array Holder for Citizen CLL020 and CLL030, Gold (Au) Plating - Two Piece Design
0877600617 Datasheet pdf image
166Kb/4P
2.00mm (.079 0.76關m (30關") Gold (Au) Selective Plating, Tray, Lead-free
1804160001 Datasheet pdf image
43Kb/1P
LED Array Holder for Citizen CLL040 and CLL050, Gold (Au) Plating - Two Piece Design
10/18/2012
0901200320 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 40 Circuits, Gold (Au) Plating
0901200135 Datasheet pdf image
1Mb/9P
2.54mm (.100") Pitch C-Grid III??Header, Single Row, Vertical, 15 Circuits, Tin (Sn) Plating
0901200129 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 9 Circuits, Tin (Sn) Plating
0901200132 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 12 Circuits, Tin (Sn) Plating
0901200128 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 8 Circuits, Tin (Sn) Plating
0901200136 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 16 Circuits, Tin (Sn) Plating
0901200127 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 7 Circuits, Tin (Sn) Plating
0901200122 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 2 Circuits, Tin (Sn) Plating
0901200125 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 5 Circuits, Tin (Sn) Plating
0901200156 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 36 Circuits, Tin (Sn) Plating
0901200142 Datasheet pdf image
1Mb/9P
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, 22 Circuits, Tin (Sn) Plating

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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