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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 836 (1/42) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0781271268 Datasheet pdf image
592Kb/9P
0.50mm (.020") Pitch FFC/FPC Connector, SMT, Non ZIF, Vertical, Reverse, Gold Plating
0781271388 Datasheet pdf image
592Kb/9P
0.50mm (.020") Pitch FFC/FPC Connector, SMT, Non ZIF, Vertical, Reverse, Gold Plating
0781271308 Datasheet pdf image
592Kb/9P
0.50mm (.020") Pitch FFC/FPC Connector, SMT, Non ZIF, Vertical, Reverse, Gold Plating
0781271338 Datasheet pdf image
592Kb/9P
0.50mm (.020") Pitch FFC/FPC Connector, SMT, Non ZIF, Vertical, Reverse, Gold Plating
0757571201 Datasheet pdf image
177Kb/4P
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, Gold (Au) Flash Plating
0781271108 Datasheet pdf image
592Kb/9P
0.50mm (.020") Pitch FFC/FPC Connector, SMT, Non ZIF, Vertical, Reverse, Gold Plating
0781191358 Datasheet pdf image
593Kb/9P
0.50mm (.020") Pitch FFC/FPC Connector, SMT, Non ZIF, Vertical, Gold Plating, 35 Circuits
0781191328 Datasheet pdf image
593Kb/9P
0.50mm (.020") Pitch FFC/FPC Connector, SMT, Non ZIF, Vertical, Gold Plating, 32 Circuits
0781191148 Datasheet pdf image
593Kb/9P
0.50mm (.020") Pitch FFC/FPC Connector, SMT, Non ZIF, Vertical, Gold Plating, 14 Circuits
0757576121 Datasheet pdf image
177Kb/4P
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 2.5um (100u") Tin (Sn) Plating
0757576431 Datasheet pdf image
177Kb/4P
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.5um (60u") Tin (Sn) Plating
0757575181 Datasheet pdf image
177Kb/4P
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 2.50um (100u") Tin (Sn) Plating
0757571442 Datasheet pdf image
177Kb/4P
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 1.5um (60u") Tin (Sn) Plating
0757571421 Datasheet pdf image
177Kb/4P
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.5um (60u") Tin (Sn) Plating
0757576101 Datasheet pdf image
177Kb/4P
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5um (100u") Tin (Sn) Plating
0757576401 Datasheet pdf image
177Kb/4P
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 1.5um (60u") Tin (Sn) Plating
0873682225 Datasheet pdf image
131Kb/3P
2.00mm (.079") Pitch Milli-Grid Receptacle, Surface Mount, Side Entry, 0.76um (30u") Gold (Au) Plating
0873682624 Datasheet pdf image
131Kb/3P
2.00mm (.079") Pitch Milli-Grid Receptacle, Surface Mount, Side Entry, 0.38um (15u") Gold (Au) Plating
0873812064 Datasheet pdf image
327Kb/6P
2.00mm (.079") Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.38um (15u") Gold (Au) Plating
0783950002 Datasheet pdf image
327Kb/6P
0.80mm(.031"), 1.27mm(.050") Micro SAS Receptacle, Right Angle, SMT, 0.76um (30u") Gold (Au) Plating

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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