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PLATING Datasheet, PDF

Searched Keyword : 'PLATING' - Total: 1753 (1/88) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
0022121161 Datasheet pdf image
154Kb/4P
2.50mm (.098) Pitch Header, Right Angle, Square Pin, 16 Circuits, Gold (Au) Plating
0022051101 Datasheet pdf image
243Kb/5P
2.50mm (.098) Pitch Header, Right Angle, Square Pin, 10 Circuits, Tin (Sn) Plating
22-05-3021 Datasheet pdf image
55Kb/2P
KK짰 254 Solid Header, Right Angle, with Friction Lock, 2 Circuits, Tin (Sn) Plating
22-05-3061 Datasheet pdf image
55Kb/2P
KK짰 254 Solid Header, Right Angle, with Friction Lock, 6 Circuits, Tin (Sn) Plating
22-05-3101 Datasheet pdf image
55Kb/2P
KK짰 254 Solid Header, Right Angle, with Friction Lock, 10 Circuits, Tin (Sn) Plating
22-05-3031 Datasheet pdf image
55Kb/2P
KK짰 254 Solid Header, Right Angle, with Friction Lock, 3 Circuits, Tin (Sn) Plating
22-05-3041 Datasheet pdf image
55Kb/2P
nullKK짰 254 Solid Header, Right Angle, with Friction Lock, 4 Circuits, Tin (Sn) Plating
22-05-3081 Datasheet pdf image
55Kb/2P
KK짰 254 Solid Header, Right Angle, with Friction Lock, 8 Circuits, Tin (Sn) Plating
22-05-3051 Datasheet pdf image
55Kb/2P
KK짰 254 Solid Header, Right Angle, with Friction Lock, 5 Circuits, Tin (Sn) Plating
22-05-3091 Datasheet pdf image
55Kb/2P
KK짰 254 Solid Header, Right Angle, with Friction Lock, 9 Circuits, Tin (Sn) Plating
22-05-3071 Datasheet pdf image
55Kb/2P
KK짰 254 Solid Header, Right Angle, with Friction Lock, 7 Circuits, Tin (Sn) Plating
0015477764 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 64 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0015800225 Datasheet pdf image
1Mb/7P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0015477672 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 72 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0015477726 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 26 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0015477766 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 66 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0015477750 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0015477630 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0015477640 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0015477654 Datasheet pdf image
388Kb/4P
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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What is PLATING


Electronic component plating plays an important role in the manufacturing process of electronic components.

Plating is used to improve the appearance of electronic components or improve their electronic performance.

For example, plating is used to prevent corrosion and improve durability.

Plating is also used to improve electrical resistance and electrical conductivity.

These platings can be applied to connecting pins, pads, cases, and other parts of electronic components.

The types of plating used in electronic components include gold, silver, nickel, and copper.

Among them, gold plating is the most used and widely used because of its excellent corrosion resistance and electrical performance.

The types and application methods of plating for electronic parts vary depending on the purpose of the part, device composition, and usage environment.

Therefore, during electronic component manufacturing, efforts are made to ensure optimum performance and durability by selecting the appropriate plating method.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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