PLASTIC-ENCAPSULATE Datasheet(PDF) - SLD-1026Z

What is PLASTIC-ENCAPSULATE

PLASTIC-ENCAPSULATE is an electronic component, usually in a small package made of plastic.

These packages are especially used in surface mount technology and are designed to protect and secure many types of electronic components.

PLASTIC-ENCAPSULATE has the advantages of small size, light weight and durability.

They are also cost-effective, so they can be mass-produced and can be manufactured in a variety of shapes and sizes.

For this reason, PLASTIC-ENCAPSULATE is widely used in electronic products, especially in various fields such as mobile devices, computers, and communication technologies.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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Manufacturer	Part #	Datasheet	Description
SIRENZA MICRODEVICES	SLD-1026Z	822Kb/21P	3 Watt Discrete LDMOS Device Plastic Surface Mount Package

PLASTIC-ENCAPSULATE Datasheet, PDF

What is PLASTIC-ENCAPSULATE

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