CERAMIC Datasheet(PDF) - XC32M4 - Suzhou HangJing Electronic Technology Co., LTD

Electronic Components Datasheet Search

ALLDATASHEET.COM

X

CERAMIC Datasheet, PDF

: P-tec Corporation(6)Pacific Silicon Sensor,Inc.(1)Panasonic Battery Group(4)Panasonic Semiconductor(158)Peregrine Semiconductor(2)Peregrine Semiconductor Corp.(1)Pericom Semiconductor Corporation(2)PerkinElmer Optoelectronics(2)PETERMANN-TECHNIK(15)Power Analog Micoelectronics(1)PREMO CORPORATION S.L(4)Pro-Wave Electronic Corp.(1)Projects Unlimited, Inc.(17)PUI audio inc.(4)Pulse A Technitrol Company(40)Qimonda AG(1)QUARTZCOM the communications company(7)Quelighting Corp(8)Raltron Electronics Corporation(7)RCD COMPONENTS INC.(8)RENCO ELECTRONICS, INC.(5)Renesas Technology Corp(2)RF Monolithics, Inc(4)RFE international(20)Riedon Powertron(3)Rochester Electronics(1)Rohm(14)Rosenberger Hochfrequenztechnik GmbH & Co. KG(1)Sames(1)Samsung semiconductor(71)SAMWHA ELECTRIC(1)Schneider Electric(1)Schurter Inc.(5)Seme LAB(100)Semikron International(3)Semtech Corporation(1)Sensata Technologies, Inc.(1)Shanghai Leiditech Electronic Technology Co., Ltd(8)Sharma Electro Components,Inc(5)Shenzhen Luguang Electronic Technology Co., Ltd(109)Shoulder Electronics Limited.(30)Siemens Semiconductor Group(2)Silonex Inc.(2)Simtek Corporation(1)SIRENZA MICRODEVICES(3)Skyworks Solutions Inc.(5)SparkFun Electronics(2)Stackpole Electronics, Inc.(11)STANLEY ELECTRIC CO.,LTD.(1)STMicroelectronics(1)Sumida Corporation(4)SunLED Corporation(4)Suntan Capacitors(38)Suntsu Electronics, Inc.(84)Superworld Electronics(12)Suzhou HangJing Electronic Technology Co., LTD(41)SynQor Worldwide Headquarters(5)T-Global Technology(1)TAITRON Components Incorporated(2)Taiyo Yuden (U.S.A.), Inc(5392)Taoglas antenna solutions(30)TDK Electronics(11713)TE Connectivity Ltd(1)TEMEX(10)Texas Instruments(21)Texas Instruments(21)Thinki Semiconductor Co., Ltd.(2)Tiger Electronic Co.,Ltd(17)Token Electronics Industry Co., Ltd.(34)TOKO, Inc(34)Torex Semiconductor(5)Transcom, Inc.(14)Transko Electronics, Inc.(84)TT Electronics.(3)TXC Corporation.(12)Tyco Electronics(3)
: More Close

Searched Keyword : 'CERAMIC' - Total: 41 (1/3) Pages

Manufacturer	Part #	Datasheet	Description
Suzhou HangJing Electro...	XC32M4	318Kb/1P	QUARTZ CRYSTAL UNIT IN SMD 3.2X2.5MM CERAMIC SEAM SEAL PACKAGE
	XC21M4	319Kb/1P	QUARTZ CRYSTAL UNIT IN SMD 2.0X1.6MM CERAMIC SEAM SEAL PACKAGE.
	FC11M2	339Kb/1P	TUNING FORK CRYSTAL IN SMD 1.6X1.0MM CERAMIC SEAM SEAL PACKAGE
	XC53M2	210Kb/1P	QUARTZ CRYSTAL UNIT IN SMD 5.0X3.2MM CERAMIC SEAM SEAL PACKAGE
	XC75M4	322Kb/1P	QUARTZ CRYSTAL UNIT IN SMD 7.0X5.0MM CERAMIC SEAM SEAL PACKAGE
	FC21M2	327Kb/1P	TUNING FORK CRYSTAL IN SMD 2.0X1.2MM CERAMIC SEAM SEAL PACKAGE.
	XC22M4	319Kb/1P	QUARTZ CRYSTAL UNIT IN SMD 2.5X2.0MM CERAMIC SEAM SEAL PACKAGE.
	XC53M4	325Kb/1P	QUARTZ CRYSTAL UNIT IN SMD 5.0X3.2MM CERAMIC SEAM SEAL PACKAGE.
	FC31M2	273Kb/1P	TUNING FORK CRYSTAL IN SMD 3.2X1.5MM CERAMIC SEAM SEAL PACKAGE
	XC11M4	345Kb/1P	QUARTZ CRYSTAL UNIT IN SMD 1.6X1.2MM CERAMIC SEAM SEAL PACKAGE
	CO32C6	303Kb/1P	OSCILLATOR UNIT WITH HCSL OUTPUT IN SMD 3.2X2.5MM CERAMIC SEAM SEAL
	CO32D6	323Kb/1P	OSCILLATOR UNIT WITH LVDS OUTPUT IN SMD 3.2X2.5MM CERAMIC SEAM SEAL
	CO32P6	303Kb/1P	OSCILLATOR UNIT WITH LVPECL OUTPUT IN SMD 3.2X2.5MM CERAMIC SEAM SEAL
	CO53C6	303Kb/1P	OSCILLATOR UNIT WITH HCSL OUTPUT IN SMD 5.0X3.2MM CERAMIC SEAM SEAL
	CO53P6	303Kb/1P	OSCILLATOR UNIT WITH LVPECL OUTPUT IN SMD 5.0X3.2MM CERAMIC SEAM SEAL
	CO75H4	426Kb/1P	OSCILLATOR UNIT WITH CMOS OUTPUT IN SMD 7.0X5.0MM CERAMIC SEAM SEAL
	CO53H4	479Kb/1P	OSCILLATOR UNIT WITH CMOS OUTPUT IN SMD 5.0X3.2MM CERAMIC SEAM SEAL
	CO75P6	394Kb/1P	OSCILLATOR UNIT WITH LVPECL OUTPUT IN SMD 7.0X5.0MM CERAMIC SEAM SEAL
	CO32H4	428Kb/1P	OSCILLATOR UNIT WITH CMOS OUTPUT IN SMD 3.2X2.5MM CERAMIC SEAM SEAL
	VC75H6	307Kb/1P	VCXO UNIT WITH HCMOS OUTPUT IN SMD 7.0X5.0MM CERAMIC SEAM SEAL PACKAGE.

1 2 3 >

1 2 3 >

What is CERAMIC

In electronic components, Ceramic is generally used to create a variety of capacitors (electric capacity) or substrate (substrate).

Ceramic capacitors have a small size and high electrical capacity and have stable performance at high frequencies.

CERAMIC Substrate is used to form a joint or circuit of electronic components, especially for stable signaling in high frequency or high -power applications.

Ceramic electronic components are used in various fields because they have the advantages of small size, high durability, stable performance, and excellent performance at high temperatures.

It is especially used in mobile devices such as mobile phones, computers, tablets, digital cameras, and TVs.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

ALLDATASHEET.COM

Does ALLDATASHEET help your business so far? [ DONATE ]

About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List
All Rights Reserved©Alldatasheet.com

Mirror Sites English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz

Family Site : ic2ic.com | icmetro.com