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CAPABLE Datasheet, PDF

Searched Keyword : 'CAPABLE' - Total: 225 (1/12) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Molex Electronics Ltd.
1502010007 Datasheet pdf image
42Kb/1P
Ditto Hermaphroditic Crimp Housing, Positive Lock, 7 Circuit, Glow-Wire Capable
1502010002 Datasheet pdf image
42Kb/1P
Ditto Hermaphroditic Crimp Housing, Positive Lock, 2 Circuit, Glow-Wire Capable
0469911010 Datasheet pdf image
51Kb/2P
Mini-Fit Jr. Reflow Solder Capable Header, Right Angle, Dual Row, 10 Circuits, without Mounting Peg, Tin (Sn) Over Nickel (Ni) Plating, Glow Wire Capable
0469911024 Datasheet pdf image
51Kb/2P
Mini-Fit Jr. Reflow Solder Capable Header, Right Angle, Dual Row, 24 Circuits, without Mounting Peg, Tin (Sn) Over Nickel (Ni) Plating, Glow Wire Capable
1502010004 Datasheet pdf image
42Kb/1P
Ditto Hermaphroditic Crimp Housing, Positive Lock, 4 Circuit, Glow-Wire Capable
0469914004 Datasheet pdf image
52Kb/2P
Mini-Fit Jr. Reflow Solder Capable Header, Right Angle, Dual Row, 4 Circuits, without Mounting Peg, Tin (Sn) Over Nickel (Ni) Plating, Glow Wire Capable
1502010005 Datasheet pdf image
42Kb/1P
Ditto Hermaphroditic Crimp Housing, Positive Lock, 5 Circuit, Glow-Wire Capable
1502010003 Datasheet pdf image
42Kb/1P
Ditto Hermaphroditic Crimp Housing, Positive Lock, 3 Circuit, Glow-Wire Capable
1502010006 Datasheet pdf image
42Kb/1P
Ditto Hermaphroditic Crimp Housing, Positive Lock, 6 Circuit, Glow-Wire Capable
1502010008 Datasheet pdf image
42Kb/1P
Ditto Hermaphroditic Crimp Housing, Positive Lock, 8 Circuit, Glow-Wire Capable
0469911012 Datasheet pdf image
51Kb/2P
Mini-Fit Jr. Reflow Solder Capable Header, Right Angle, Dual Row, 12 Circuits, without Mounting Peg, Tin (Sn) Over Nickel (Ni) Plating, Glow Wire Capable
0462070210 Datasheet pdf image
31Kb/2P
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row
0462070108 Datasheet pdf image
31Kb/2P
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row
0462070024 Datasheet pdf image
31Kb/2P
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical
0462070106 Datasheet pdf image
31Kb/2P
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row
0462070206 Datasheet pdf image
31Kb/2P
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row
0462070112 Datasheet pdf image
31Kb/2P
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row
0449145802 Datasheet pdf image
35Kb/2P
Micro-Fit CPI Header, Dual Row, Vertical, Capable Pin Interface, 8 Circuits
0462070012 Datasheet pdf image
32Kb/2P
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical
0462070124 Datasheet pdf image
31Kb/2P
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row

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What is CAPABLE


In electronic components, capable means having the ability to perform a certain task or function.

When an electronic component is capable, it indicates that the component or device has the ability to do the desired task.

Capable can be described in many different ways. Some examples are:

Functionally capable: When an electronic component is functionally capable, it means that the component or device has the ability to perform a desired function.

For example, we can say that a microprocessor is capable of performing a specific task.

Performance-wise capable: When an electronic component is performance-wise capable, it means that the component or device has the ability to meet certain performance requirements.

For example, a sensor can be said to be capable of providing accurate measurement results.

Expansively capable: Some electronic components can be capable extensively.

This means that a component or device has the ability to support additional functions or extensions of functionality.

For example, a computer board with expansion slots can be said to be capable of expanding its functionality by adding another card.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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