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HEAT Datasheet, PDF

Searched Keyword : 'HEAT' - Total: 9972 (1/499) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
CUI INC
HSB18-232310 Datasheet pdf image
398Kb/3P
HEAT SINK
HSE-B18X-035H Datasheet pdf image
513Kb/7P
HEAT SINK
HSE-BX-01 Datasheet pdf image
404Kb/4P
HEAT SINK
HSE-BX-02 Datasheet pdf image
476Kb/5P
HEAT SINK
HSE-BX-04H Datasheet pdf image
357Kb/4P
HEAT SINK
HSB10-232306 Datasheet pdf image
352Kb/3P
HEAT SINK
HSB19-272718 Datasheet pdf image
401Kb/3P
HEAT SINK
Company Logo Img
CUI Devices
HSB10-232306 Datasheet pdf image
389Kb/3P
HEAT SINK
08/05/2022
Company Logo Img
TRACO Electronic AG
TEN-HS2 Datasheet pdf image
310Kb/1P
Heat Sink
Rev. November 30, 2022
THM-HS1 Datasheet pdf image
2Mb/1P
Heat Sink
Rev. November 30, 2022
THN-HS2 Datasheet pdf image
1Mb/1P
Heat Sink
Rev. November 30, 2022
TEN-HS6 Datasheet pdf image
251Kb/1P
Heat Sink
Rev. November 30, 2022
Company Logo Img
List of Unclassifed Man...
SP254 Datasheet pdf image
178Kb/3P
Heat Shrink
Company Logo Img
CUI INC
HSS-B20-02 Datasheet pdf image
292Kb/3P
HEAT SINK
HSE-18X Datasheet pdf image
512Kb/6P
HEAT SINK
HSE-B18X-060H-W Datasheet pdf image
481Kb/6P
HEAT SINK
HSE-B20250-045H Datasheet pdf image
294Kb/3P
HEAT SINK
HSE-BX-035H Datasheet pdf image
547Kb/8P
HEAT SINK
HSE-BX-035H-01 Datasheet pdf image
378Kb/4P
HEAT SINK
HSB09-212115 Datasheet pdf image
391Kb/3P
HEAT SINK

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What is HEAT


Heat refers to the heat generated by electronic components. Electronic components operate using electricity, and a certain amount of heat is generated during this operation.

This heat affects the performance of electronic components and can cause them to overheat and damage them.

Therefore, thermal management is very important in electronic components.

Various electronic components and solutions for thermal management have been developed, some of which include:

Heat Sink: A device for absorbing and conducting heat, and is mostly made of metal such as aluminum.

Used for parts that generate a lot of heat, such as CPUs and GPUs.

Fan: It is used with a heat sink that absorbs heat and is used to quickly dissipate heat.

Thermal Interface Material: It is used between the heat sink and the parts, and it quickly dissipates heat by improving heat conduction.

Heat Pipe: This is a technology for effectively transferring heat, and is mainly used in portable devices such as laptops.

Liquid Cooling: This is a cooling technology using liquid, which is used in high-performance computers and game consoles.

These thermal management solutions are critical to maintaining the reliability and performance of electronic components.

Thermal management considerations are therefore essential in the design and manufacture of electronic components.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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