# Quartz Crystal - CSX4 Model

## General Specifications
· Dimensions: 11.6 x 11.6 mm Ceramic SMD Crystal
· Frequency Range: 3.5MHz to 30MHz
· Calibration Tolerance: ±30ppm to ±100ppm
· Frequency Stability: ±30ppm to ±100ppm
· Temperature Range: -40°C to 85°C (extended: -45°C to 125°C)
· RoHS Compliant

## Frequency Tolerance and Stability
· A: ±30 ppm at 25°C
· B: ±50 ppm (-10 to 60°C)
· C: ±100 ppm (-10 to 60°C)
· D: ±50 ppm (-20 to 70°C)
· E: ±100 ppm (-20 to 70°C)
· G: ±100 ppm (-40 to 85°C)

## Electrical Characteristics
· Shunt Capacitance: 7.0pF Max
· Drive Level: 100uW Typical, 300uW Max
· Aging: ±5ppm Max 1st/yr
· ESR: Varies with frequency (see table)
- 3.5~4.0MHz= 200 Ohms Max
- 4.1~6.0MHz= 150 Ohms Max
- 6.1~10.0MHz= 100 Ohms Max
- 10.1~14.0MHz= 80 Ohms Max
- 14.1~30.0MHz= 50 Ohms Max

## Physical Characteristics
· Dimensions: 0.357±0.008 (11.6±0.20) x 0.126±0.02 (5.5±0.50) mm
· Suggested Pad Layout provided in datasheet.

## Reflow Soldering Profile
· Preheat: 180 Secs. Max.
· Critical Temperature Zone: 217°C
· Peak Temperature: 260°C for 10 Secs. Max.
· Ramp-Up: 3°C/Sec Max.
· Ramp-Down: 6°C/Sec.
· *Note:* Profile with 240°C peak also acceptable.

## Environmental Tests
· Gross Leak Test: MIL-STD-883, Method 1014.10, Condition C
· Fine Leak Test: MIL-STD-883, Method 1014.10, Condition A2
· Thermal Shock: MIL-STD-883, Method 1011.9, Condition A
· Moisture Resistance: MIL-STD-883, Method 1004.7
· Shock: MIL-STD-883, Method 2003.7 (±5ppm max)
· Solderability: MIL-STD-883, Method 2003.7
· Vibration: MIL-STD-883, Method 2003.7 (±5ppm max)
· Solvent Resistance: MIL-STD-202, Method 215
· Resistance to Soldering Heat: MIL-STD-202, Method 210, Condition I or J

## Packaging
· 2K Tape and Reel