Manufacturer | Part # | Datasheet | Description |
Lumileds Lighting Compa... |
L1F3-U380200006000
|
1Mb/24P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U380200006000
|
1Mb/2P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U380200006000
|
1Mb/23P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
20180531
|
L1F3-U380200008000
|
1Mb/24P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U380200008000
|
1Mb/2P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U380200008000
|
1Mb/23P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
20180531
|
L1F3-U380200010000
|
1Mb/24P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U380200010000
|
1Mb/2P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U390200010000
|
1Mb/24P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U390200010000
|
1Mb/2P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U390200012000
|
1Mb/2P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U390200012000
|
1Mb/23P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
20180531
|
L1F3-U390200012000
|
1Mb/24P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U400200010000
|
1Mb/24P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U400200010000
|
1Mb/2P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U400200012000
|
1Mb/24P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U400200012000
|
1Mb/2P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U400200012000
|
1Mb/23P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
20180531
|
L1F3-U400200014000
|
1Mb/24P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|
L1F3-U400200014000
|
1Mb/2P
|
Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
|