| Manufacturer | Part # | Datasheet | Description |
Samsung semiconductor |
CIB10J300
|
757Kb/5P
|
Chip Bead For EMI Suppression
|
|
CIB10P100
|
757Kb/5P
|
Chip Bead For EMI Suppression
|
|
CIB10P220
|
757Kb/5P
|
Chip Bead For EMI Suppression
|
|
CIB10P260
|
757Kb/5P
|
Chip Bead For EMI Suppression
|
|
CIB10P300
|
757Kb/5P
|
Chip Bead For EMI Suppression
|
|
CIB10P330
|
757Kb/5P
|
Chip Bead For EMI Suppression
|
| Search Partnumber :
Start with "CIB10" -
Total : 16 ( 1/1 Page) |
Samsung semiconductor |
CIB10J300
|
757Kb/5P |
Chip Bead For EMI Suppression
|
|
CIB10P100
|
757Kb/5P |
Chip Bead For EMI Suppression
|
|
CIB10P220
|
757Kb/5P |
Chip Bead For EMI Suppression
|
|
CIB10P260
|
757Kb/5P |
Chip Bead For EMI Suppression
|
|
CIB10P300
|
757Kb/5P |
Chip Bead For EMI Suppression
|
|
CIB10P330
|
757Kb/5P |
Chip Bead For EMI Suppression
|
Banner Engineering Corp... |
CIB-1
|
501Kb/8P |
SMI30 Series Sensor
|
Samsung semiconductor |
CIB21J260
|
4Mb/31P |
MULTILAYER CHIP COMPONENTS
|
|
CIB21J400
|
4Mb/31P |
MULTILAYER CHIP COMPONENTS
|
|
CIB21P110
|
4Mb/31P |
MULTILAYER CHIP COMPONENTS
|
|
CIB21P150
|
4Mb/31P |
MULTILAYER CHIP COMPONENTS
|
|
CIB21P260
|
4Mb/31P |
MULTILAYER CHIP COMPONENTS
|
|
CIB21P260NE
|
1Mb/16P |
Chip Bead CIB/CIM Series For EMI Suppression
|
|
CIB21P330
|
4Mb/31P |
MULTILAYER CHIP COMPONENTS
|
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