Manufacturer | Part # | Datasheet | Description |
List of Unclassifed Man... |
44060
|
104Kb/1P
|
PRIMARY VOLTAGE, Vacuum filling, Two compartments bobbins
|
4406000400
|
2Mb/164P
|
We are Dedicated to Achieving Customer Satisfaction Through Continuous Improvement
|
Turck, Inc. |
44065
|
1Mb/3P
|
Inductive Sensor
11/07/2023
|
4406551
|
1Mb/3P
|
Inductive Sensor
11/07/2023
|
44067
|
1Mb/3P
|
Inductive Sensor
11/07/2023
|
Molex Electronics Ltd. |
44067-0201
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
44067-0401
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
44067-0402
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
44067-0403
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
|
44067-0601
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating
|
44067-0602
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm
|
44067-0603
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
44067-0801
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
44067-0802
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick
|
44067-1001
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
44067-1002
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
44067-1003
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
44067-1201
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating
|
44067-1202
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
44067-1203
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
|