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MTD48 - 48 Lead Molded Thin Shrink Small Outline Package, JEDEC - National Semiconductor |
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Related Electronics Part Number |
| Part Number | Components Description | Html View | Manufacturer |
| MTC16 | 16 Lead Molded Thin Shrink Small Outline Package JEDEC NS Package Number MTC16 | 1 | National Semiconductor |
| FPT-20P-M04 | THIN SHRINK SMALL OUTLINE PACKAGE | 1 | Fujitsu Component Limited. |
| MC16A | 16 Lead Ceramic Small Outline Package NS Package Number MC16A | 1 | National Semiconductor |
| M24.173B | Thin Shrink Small Outline Wxposed Pad Plastic Packages EPTSSOP | 1 | Intersil Corporation |
| SSOP24 | 24-LEAD SHRINK SMALL OUTLINE PACKAGE | 1 2 3 4 | STMicroelectronics |
| SOT765-1 | plastic very thin shrink small outline package; 8 leads; body width 2.3 mm | 1 | NXP Semiconductors |
| MC28B | 28 Lead Ceramic Small Outline Package EPROM NS Package | 1 | National Semiconductor |
| MSA20 | 20-Lead Shrink Small Outline Package SSOP EIAJ TYPE II 5.3mm Wide Package Number MSA20 | 1 | Fairchild Semiconductor |
| 21-0114B | PACKAGE OUTLINE 6 LEAD THIN SOT23 LOW PROFILE | 1 | Maxim Integrated Products |
| TSSO20 | 20-LEAD THIN SHRINK SMALL OUTLINE | 1 2 3 4 | STMicroelectronics |
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