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FDMS8570SDC Datasheet (PDF) - Fairchild Semiconductor

FDMS8570SDC Datasheet PDF - Fairchild Semiconductor
Part # FDMS8570SDC
Download  FDMS8570SDC Download

File Size   1163.37 Kbytes
Page   2 Pages
Manufacturer  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor
Description DUAL COOL??PACKAGE POWERTRENCH짰 MOSFETs

FDMS8570SDC Datasheet (PDF)

Go To PDF Page Download Datasheet
FDMS8570SDC Datasheet PDF - Fairchild Semiconductor

Part # FDMS8570SDC
Download  FDMS8570SDC Click to download

File Size   1163.37 Kbytes
Page   2 Pages
Manufacturer  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor
Description DUAL COOL??PACKAGE POWERTRENCH짰 MOSFETs

FDMS8570SDC Datasheet (HTML) - Fairchild Semiconductor

FDMS8570SDC Datasheet HTML 1Page - Fairchild Semiconductor FDMS8570SDC Datasheet HTML 2Page - Fairchild Semiconductor

FDMS8570SDC Product details

Dual Cool™ packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predecessors, the use of a heat sink with Dual Cool packaging technology provides even more impressive results. Test results prove that, when a heat sink is used with our Dual Cool package technology, synchronous buck converters deliver higher output current and increased power density. With Fairchild’s trench silicon technology, Dual Cool packaging technology proves to be a clear leader in power density and thermal performance. Our Dual Cool package solutions are lead free and RoHS compliant and are available in 3.3 mm x 3.3 mm and 5 mm x 6 mm PQFN packages.

Features
•  Top-side cooling, lower thermal resistance from junction to top
•  Same land pattern as 5 mm x 6 mm and 3.3 mm x 3.3 mm PQFN – JEDEC standard
•  Allows higher current and power dissipation
•  Highest power density for DC-DC applications
•  Use with or without a heat sink, reduces the number of qualifed components in the BOM
•  Multiple suppliers without cross licensing requirements
•  High degree of production commonality with standard PQFN packaging
•  25 V - 150 V portfolio

Applications
•  Point-of-load (POL) synchronous-buck conversion
•  Servers
•  Telecommunications, routing and switching
•  Heat path from top only




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About Fairchild Semiconductor


Fairchild Semiconductor was a pioneering semiconductor company that was founded in the late 1950s.
The company was known for its innovation in the development of the first commercial transistor and for its contributions to the advancement of the integrated circuit technology.
Fairchild became a leading supplier of power semiconductors, analog and mixed-signal integrated circuits, and other semiconductor products.
The company was acquired by ON Semiconductor in 2016 and its products and technologies continue to be developed and sold under the ON Semiconductor brand.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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