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S70FL256P Datasheet (PDF) - SPANSION

S70FL256P Datasheet PDF - SPANSION
Part # S70FL256P
Download  S70FL256P Download

File Size   825.69 Kbytes
Page   19 Pages
Manufacturer  SPANSION [SPANSION]
Direct Link  http://www.spansion.com
Logo SPANSION - SPANSION
Description 256-Mbit CMOS 3.0 Volt Flash Memory with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus

S70FL256P Datasheet (PDF)

Go To PDF Page Download Datasheet
S70FL256P Datasheet PDF - SPANSION

Part # S70FL256P
Download  S70FL256P Click to download

File Size   825.69 Kbytes
Page   19 Pages
Manufacturer  SPANSION [SPANSION]
Direct Link  http://www.spansion.com
Logo SPANSION - SPANSION
Description 256-Mbit CMOS 3.0 Volt Flash Memory with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus

S70FL256P Datasheet (HTML) - SPANSION

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S70FL256P Product details

General Description
This document contains information for the S70FL256P device, which is a dual die stack of two S25FL129P die.
   
Distinctive Characteristics
Architectural Advantages
■ Single power supply operation
    – Full voltage range: 2.7 to 3.6V read and write operations
■ Memory architecture
    – Uniform 64 kB sectors
    – Top or bottom parameter block (Two 64-kB sectors broken down
        into sixteen 4-kB sub-sectors each) for each Flash die
    – Uniform 256 kB sectors (no 4-kB sub-sectors)
    – 256-byte page size
■ Program
    – Page Program (up to 256 bytes) in 1.5 ms (typical)
    – Program operations are on a page by page basis
    – Accelerated programming mode via 9V W#/ACC pin
    – Quad Page Programming
■ Erase
    – Bulk erase function for each Flash die
    – Sector erase (SE) command (D8h) for 64 kB and 256 kB sectors
    – Sub-sector erase (P4E) command (20h) for 4 kB sectors
        (for uniform 64-kB sector device only)
    – Sub-sector erase (P8E) command (40h) for 8 kB sectors
        (for uniform 64-kB sector device only)
■ Cycling endurance
    – 100,000 cycles per sector typical
■ Data retention
    – 20 years typical
■ Device ID
    – JEDEC standard two-byte electronic signature
    – RES command one-byte electronic signature for backward
        compatibility   
■ One time programmable (OTP) area on each Flash die for
    permanent, secure identification; can be programmed and
    locked at the factory or by the customer
■ CFI (Common Flash Interface) compliant: allows host system
    to identify and accommodate multiple flash devices
■ Process technology
    – Manufactured on 0.09 µm MirrorBit® process technology
■ Package option
    – Industry Standard Pinouts
    – 16-pin SO package (300 mils)
    – 24-ball BGA (6 x 8 mm) package, 5 x 5 pin configuration
    (Continue ...)
   




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