87914-0616 Datasheet(PDF) - Molex Electronics Ltd.

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87914-0616 Datasheet (PDF) - Molex Electronics Ltd.

87914-0616 Datasheet PDF - Molex Electronics Ltd.


Part #	87914-0616

Download	87914-0616 Download

File Size	3781.82 Kbytes

Page	48 Pages

Manufacturer	MOLEX10 [Molex Electronics Ltd.]

Direct Link	http://www.molex.com

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Description

2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 6 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

87914-0616 Datasheet (PDF)

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87914-0616 Datasheet PDF - Molex Electronics Ltd.


Part #	87914-0616

Download	87914-0616 Click to download

File Size	3781.82 Kbytes

Page	48 Pages

Manufacturer	MOLEX10 [Molex Electronics Ltd.]

Direct Link	http://www.molex.com

Logo

Description	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 6 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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Similar Part No. - 87914-0616

Manufacturer	Part #	Datasheet	Description
Molex Electronics Ltd.	87914-0009	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 6 Circuits, Gold (Au) Flash Overall Plating, Tray Packaging, Lead-free
	87914-0216	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 2 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-0806	770Kb / 11P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-0807	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54關m (100關) Tin (Sn) Overall Plating, Tray Packaging
	87914-0816	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

Similar Description - 87914-0616

Manufacturer	Part #	Datasheet	Description
Molex Electronics Ltd.	0879142416	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 24 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879144216	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879144016	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 40 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879142816	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879143416	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879142616	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 26 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879140816	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879144416	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879141216	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 12 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879141816	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

About Molex Electronics Ltd.

Molex Electronics Ltd. is a subsidiary of Koch Industries, Inc., and is a global manufacturer of electronic and fiber optic interconnect solutions.

The company was founded in 1938 and is headquartered in Lisle, Illinois.

Molex offers a wide range of interconnect products including connectors, cable assemblies, switches, and other passive components.

These products are used in various industries including automotive, data communications, consumer electronics, industrial equipment, medical devices, and telecommunications.

With operations and facilities in over 40 countries, Molex is known for its innovation and technology leadership in the interconnect solutions market.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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