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MLP014A - 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5x3.0mm - Fairchild Semiconductor |
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Related Electronics Part Number |
| Part Number | Components Description | Html View | Manufacturer |
| QFP-EP | Exposed Pad Quad Flat Pack | 1 2 | STATS ChipPAC, Ltd. |
| QFP-SD | Stacked Die Quad Flat Pack | 1 2 | STATS ChipPAC, Ltd. |
| LQFP | Low Profile Quad Flat Pack | 1 2 | STATS ChipPAC, Ltd. |
| TQFP | Thin Profile Quad Flat Pack | 1 2 | STATS ChipPAC, Ltd. |
| MQFP | Metric Quad Flat Pack | 1 2 | STATS ChipPAC, Ltd. |
| MQFP-D | Heat Spreader Metric Quad Flat Pack | 1 2 | STATS ChipPAC, Ltd. |
| MQFP-ED | Exposed Drop-in Heat Slug Metric Quad Flat Pack | 1 2 | STATS ChipPAC, Ltd. |
| FC64 | 64-Pin Low Profile Quad Flat Package LQFP | 1 | Pericom Semiconductor Corporation |
| SOT545-3 | plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad | 1 | NXP Semiconductors |
| TQFP48 | 48-LEAD THIN QUAD FLAT | 1 2 3 4 5 | STMicroelectronics |
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