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MSA20 - 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 - Fairchild Semiconductor |
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Related Electronics Part Number |
| Part Number | Components Description | Html View | Manufacturer |
| MTC16 | 16 Lead Molded Thin Shrink Small Outline Package JEDEC NS Package Number MTC16 | 1 | National Semiconductor |
| SSOP24 | 24-LEAD SHRINK SMALL OUTLINE PACKAGE | 1 2 3 4 | STMicroelectronics |
| MTD48 | 48 Lead Molded Thin Shrink Small Outline Package JEDEC | 1 | National Semiconductor |
| TSSO20 | 20-LEAD THIN SHRINK SMALL OUTLINE | 1 2 3 4 | STMicroelectronics |
| MC16A | 16 Lead Ceramic Small Outline Package NS Package Number MC16A | 1 | National Semiconductor |
| FPT-20P-M04 | THIN SHRINK SMALL OUTLINE PACKAGE | 1 | Fujitsu Component Limited. |
| SOT340-1 | SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm | 1 | NXP Semiconductors |
| PS2915-1 | HIGH CTR AC INPUT RESPONSE TYPE 4 PIN ULTRA SMALL PACKAGE FLAT LEAD OPTOCOUPLER | 1 2 3 4 5 More | California Eastern Labs |
| M24.173B | Thin Shrink Small Outline Wxposed Pad Plastic Packages EPTSSOP | 1 | Intersil Corporation |
| MC28B | 28 Lead Ceramic Small Outline Package EPROM NS Package | 1 | National Semiconductor |
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